Process Capabilities - Rigid Printed Circuit Boards

Our teams are not afraid to color outside the lines. If you have a design that exceeds the capabilities listed, please contact us! We love working with customers at the design stage and are always pushing the boundaries.

Attributes	Standard	Prem​ium	Developing
Board Thickness	.015" - .100"	< .015" and > .100"	> .200"
Layer Count	2 - 32	2 - 32	> 32
Line Width / Space	.004" / .004"	.003" / .003"	< .002" / .002"
Aspect Ratio	10:1	Up to 13:1	> 13:1
Smallest PTH Drill - M​echanical	.008"	.006"	.005"
Pad Size - Mechanical Drill	.018"	.012"	.010"
Smallest PTH Drill - Laser	.005"	.004"	-
Pad Size - Laser Drill	.010"	.009"	.008"
Minimum Core Thickness	.003"	.001"	-
Copper Weight	Up to 2 oz.	Up to 6 oz.	> 6 oz.
Board Thickness Tolerance	10%	7%	5%
Impedance Tolerance	10%	5%	-
Lamination Cycles	Single Lam	Up to 4 Cycles	5+ Cycles

Materials

Information on materials can be found at this link.

Finishes

Information on surface finishes can be found at this link.

Product Capabilities

Sequential Lamination                                   Cavity Boards
Blind & Buried Vias                                          Via-in-Pad / VIPPO
HDI - Stacked & Staggered Vias                    Back Drill
Micro Via - Laser                                               Hybrid Multilayers
Heavy Copper (UL to 4 oz.)
Conductive, Non-conductive & Solid Copper Via Fill