WESTAK CIRCUITS
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  • Engineering
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    • Materials
    • Stack Up Considerations
    • Tooling Package
    • IPC-D-356A Netlist
  • Capabilities
    • Westak Facilities
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Capabilities

Process Capabilities - Rigid Printed Circuit Boards

Our teams are not afraid to color outside the lines. If you have a design that exceeds the capabilities listed, please contact us! We love working with customers at the design stage and are always pushing the boundaries.
Attributes
Standard
Prem​ium
Emerging
Board Thickness
.015" - .100"
< .015" and > .100"
> .200"
Layer Count
2 - 32
2 - 32
> 32
Line Width / Space
.004" / .004"
.003" / .003"
< .002" / .002"
Aspect Ratio
10:1
Up to 13:1
> 13:1
Smallest PTH Drill - M​echanical
.008"
.006"
.005"
Pad Size - Mechanical Drill
.018"
.012"
.010"
Smallest PTH Drill - Laser
.005"
.004"
-
Pad Size - Laser Drill
.010"
.009"
.008"
Minimum Core Thickness
.003"
.001"
-
Copper Weight
Up to 2 oz.
Up to 6 oz.
> 6 oz.
Board Thickness Tolerance
10%
7%
5%
Impedance Tolerance
10%
5%
-
Lamination Cycles
Single Lam
Up to 4 Cycles
5+ Cycles

Materials

Information on materials can be found at this link.

Finishes

Information on surface finishes can be found at this link.

Product Capabilities

Sequential Lamination                                   Cavity Boards
Blind & Buried Vias                                          Via-in-Pad / VIPPO
HDI - Stacked & Staggered Vias                    Back Drill
Micro Via - Laser                                               Hybrid Multilayers
Heavy Copper (UL to 4 oz.)
Conductive, Non-conductive & Solid Copper Via Fill
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Company

About Westak
​Locations
Careers/Benefits
Certifications
Corp Responsibility

Engineering

Support
Design Guidelines
​Stack Up / Impedance
Tooling Package
​
IPC-D-356A Net List

Capabilities

Westak Facilities
Global Alliances

Support

Request For Quote
​Data Transfer Options
Contact Us
​Supplier Requirements
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  • Company
    • About Westak
    • Locations
    • Careers / Benefits
    • Industry Certifications
    • Corp Responsibility
  • Engineering
    • Support
    • Design Guidelines
    • Materials
    • Stack Up Considerations
    • Tooling Package
    • IPC-D-356A Netlist
  • Capabilities
    • Westak Facilities
    • Global Alliances
  • Support
    • Request For Quote
    • Data Transfer Options
    • Contact Us
    • Supplier Requirements