Process Capabilities - Rigid Printed Circuit Boards
Our teams are not afraid to color outside the lines. If you have a design that exceeds the capabilities listed, please contact us! We love working with customers at the design stage and are always pushing the boundaries.
Information on materials can be found at this link.
Information on surface finishes can be found at this link.
Sequential Lamination Cavity Boards
Blind & Buried Vias Via-in-Pad / VIPPO
HDI - Stacked & Staggered Vias Back Drill
Micro Via - Laser Hybrid Multilayers
Heavy Copper (UL to 4 oz.)
Conductive, Non-conductive & Solid Copper Via Fill