Design For Manufacturability

When designing printed circuit boards, it's recommended that engineers and designers consider how the job will be manufactured and cost drivers that can impact the price of the board.

Some DFM considerations include :

• Material Offerings (Laminates & Copper Foils)
• Construction Options (Core v. Foil)
• Copper Weights and Trace / Space
• Stack Details
• Drilling Types / Methods
• Standard Drill Sizes
• Via Fill Options (Conductive, Non-Conductive & Solid Copper Fill)​

Westak engineers are available to discuss any of these topics and more. Contact us today!

We also offer a Design For Manufacturability (DFM) seminar for our customers that focuses on best practices to use when designing printed circuit boards. Contact us for a lunch and learn! We can cover many subjects or concentrate on just a few - seminars are tailored to your specifications.

Final Finishes

Standard Panel Sizes

ENIG (Electroless Nickel Immersion Gold)
OSP (Organic Solderability Preservation)
Immersion Silver
ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold)
​EPIG (Electroless Palladium, Immersion Gold)
Electrolytic Hard Gold Body
Electrolytic Nickel Body
Soft Bondable Electrolytic Gold
Hot Air Solder Level (HASL)
Lead Free HASL
Selective Finishes

12x18, 16x18, 14x26, ​18x24, 21x24, 21x26