Design For Manufacturability
When designing printed circuit boards, it's recommended that engineers and designers consider how the job will be manufactured and cost drivers that can impact the price of the board.
Some DFM considerations include :
Westak engineers are available to discuss any of these topics and more. Contact us today!
We also offer a Design For Manufacturability (DFM) seminar for our customers that focuses on best practices to use when designing printed circuit boards. Contact us for a lunch and learn! We can cover many subjects or concentrate on just a few - seminars are tailored to your specifications.
Standard Panel Sizes
ENIG (Electroless Nickel Immersion Gold)
OSP (Organic Solderability Preservation)
ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold)
EPIG (Electroless Palladium, Immersion Gold)
Electrolytic Hard Gold Body
Electrolytic Nickel Body
Soft Bondable Electrolytic Gold
Hot Air Solder Level (HASL)
Lead Free HASL
12x18, 16x18, 14x26, 18x24, 21x24, 21x26