PCB Manufacturing Capabilities
Rigid Printed Circuit Boards
Westak Circuits provides U.S. manufacturing support for prototype, NPI and production printed circuit boards, with capabilities ranging from standard multilayer designs to advanced high-reliability constructions.
Our manufacturing teams support a broad range of technologies, materials and design requirements, including controlled impedance, heavy copper, HDI, blind and buried vias, via fill, specialty materials and complex multilayer constructions.
Because PCB manufacturability depends on the interaction between board thickness, copper weight, hole size, material, layer count and other design requirements, actual capability should always be evaluated as a complete design rather than by a single specification.
Westak Circuits provides U.S. manufacturing support for prototype, NPI and production printed circuit boards, with capabilities ranging from standard multilayer designs to advanced high-reliability constructions.
Our manufacturing teams support a broad range of technologies, materials and design requirements, including controlled impedance, heavy copper, HDI, blind and buried vias, via fill, specialty materials and complex multilayer constructions.
Because PCB manufacturability depends on the interaction between board thickness, copper weight, hole size, material, layer count and other design requirements, actual capability should always be evaluated as a complete design rather than by a single specification.
Core Capabilities
Westak manufactures complex multilayer printed circuit boards for high-reliability and advanced electronic applications.
Capabilities include standard and advanced multilayer constructions, multiple lamination cycles and designs requiring tight registration and dimensional control. 
Westak supports heavy copper PCB requirements for applications requiring increased current capacity or thermal performance.
Heavier copper affects trace and space capability, drilling, plating, material availability and overall manufacturability, so designs using higher copper weights should be reviewed early. |
Westak supports HDI designs using laser-drilled microvias, blind and buried vias, and sequential lamination.
For designs using stacked or staggered microvias, we recommend involving Westak engineering early to evaluate material, aspect ratio, pad geometry and lamination requirements. 
Westak supports a broad range of laminate systems for applications requiring enhanced thermal, electrical or reliability performance.
Material selection should consider:
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Controlled impedance requirements are evaluated as part of the PCB stackup.
Westak engineering can assist with stackup construction, dielectric selection, trace geometry and impedance modeling to help achieve the required electrical performance while maintaining manufacturability. Your current engineering and stackup pages already emphasize this early-design collaboration. 
Capabilities include:
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Process Capability Snapshot
The specifications below are general manufacturing guidelines. Actual capability depends on the complete PCB design, including material, copper weight, layer count, thickness, hole size and other requirements.
Attributes |
Standard |
Premium |
Developing |
Board Thickness |
.015" - .100" |
< .015" and > .100" |
> .200" |
Layer Count |
2 - 32 |
2 - 32 |
> 32 |
Line Width / Space |
.004" / .004" |
.003" / .003" |
< .002" / .002" |
Aspect Ratio |
10:1 |
Up to 13:1 |
> 13:1 |
Smallest PTH Drill - Mechanical |
.008" |
.006" |
.005" |
Pad Size - Mechanical Drill |
.018" |
.012" |
.010" |
Smallest PTH Drill - Laser |
.005" |
.004" |
- |
Pad Size - Laser Drill |
.010" |
.009" |
.008" |
Minimum Core Thickness |
.003" |
.001" |
- |
Copper Weight |
Up to 2 oz. |
Up to 6 oz. |
> 6 oz. |
Board Thickness Tolerance |
10% |
7% |
5% |
Impedance Tolerance |
10% |
5% |
- |
Lamination Cycles |
Single Lam |
Up to 4 Cycles |
5+ Cycles |
Trace & Space CapabilityTrace and space capability is closely related to copper thickness.
As copper weight increases, additional spacing is generally required to maintain etch control and reliable manufacturing. Fine-line designs and heavy copper designs should therefore be evaluated independently. View Trace & Space Design Guidelines 
Mechanical DrillingHole size, finished board thickness, plating requirements and annular ring all affect drill manufacturability.
As hole size decreases or board thickness increases, aspect ratio becomes increasingly important. Westak can review:
MaterialsMaterial selection can affect performance, manufacturability, cost and lead time.
Westak supports standard and specialty laminate systems for applications requiring:
Material availability can vary significantly by laminate type, thickness and copper weight, so early review is recommended for specialty materials or heavy copper constructions. View PCB Materials |
Controlled ImpedanceA successful controlled impedance design begins with the stackup.
Westak engineering can assist with:
PCB Surface Finish OptionsWestak supports a variety of PCB surface finishes based on assembly method, solderability, wire bonding and end-use requirements.
Common finish options include:
View Surface Finish Guidelines 
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Design for Manufacturability
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Capability Is More Than a Single Number
A PCB may meet an individual published capability and still require engineering review because multiple design features interact. Examples include:
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Have a Challenging PCB Design?
Small holes. Thick boards. Heavy copper. Tight trace and space. Controlled impedance. Specialty materials. HDI.
Send us your requirements before the design is finalized and let Westak engineering help determine the most manufacturable approach.
Send us your requirements before the design is finalized and let Westak engineering help determine the most manufacturable approach.
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