PCB Manufacturing Tooling Package Requirements

Providing a complete and organized PCB fabrication data package helps Westak quote, engineer and manufacture your printed circuit boards accurately and efficiently. The information below outlines the recommended files and documentation for quotation, DFM review, CAM tooling and production.

​A complete package generally includes PCB design data, drill files, an IPC-D-356A netlist, fabrication drawing, panelization requirements and supporting documentation.

Recommended PCB Fabrication Package

• PCB design files (ODB++ or Gerber RS-274X)
• NC drill files
• IPC-D-356A netlist
• Fabrication drawing and notes
• Layer stackup
• Controlled impedance requirements, if applicable
• Array/panelization requirements, if applicable
• README or file manifest
• Customer workmanship specifications, when applicable

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Customer Specifications

A copy of your company’s approved workmanship standard or specification should accompany the first quote request and/or order placed. Additionally, suppliers should receive subsequent revisions to ensure they understand your current standards.

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PCB Design Data

Electronic fabrication data exported directly from the PCB CAD system should be provided whenever possible. Westak's preferred formats are ODB++ and Gerber RS-274X.

Include all applicable layers:

• Inner and Outer layers (all copper layers)
• Solder mask layers
• Legend / silkscreen layers
• Board profile
• Additional mechanical or fabrication layers

Best practices:

• Clearly identify the function of every file.
• Use embedded apertures when supplying Gerber RS274X.
• Supply the board profile at 1:1 scale.
• Generate solid copper areas as contours rather than painted line fills. 
• Flash pads whenever practical rather than constructing pads from drawn lines.
• Avoid reducing output coordinate resolution below the native CAD database resolution.
• Maintain appropriate copper clearance from the board edge in accordance with the design requirements and applicable fabrication rules. 
• When multiple controlled-impedance structures exist on the same layer, clearly distinguish the applicable trace geometries and impedance requirements in the fabrication document.

Solder Mask Elements to Include:

• Design component holes and Test point locations as pad master (same diameter as O/L pads)
• Designate plug or cap locations for tented or partially covered pads

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NC Drill Files

IPC-D-356A Netlist

The drill files should include the following information:

• Tool number / code
• X-Y coordinates
• Finished hole or slot size 
• Hole tolerance
• Plated / non-plated designation
• Via, press-fit or special hole designation, where applicable
• Separate drill files for blind and buried vias
• Separate laser drill files for microvias
• Clear alignment with the PCB design data

We strongly recommend providing an IPC-D-356A netlist generated directly from the PCB CAD system with the fabrication data package.
The netlist provides an independent electrical reference that can be compared against the Gerber or ODB++ data to help identify unintended opens, shorts or data discrepancies before manufacturing. It also supports CAM verification and final electrical test.
Learn more: Why IPC-D-356A Netlists are Critical

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Fabrication Drawing & Notes

The fabrication drawing should clearly define how the PCB is to be manufactured and identify all requirements that may not be obvious from the electronic design data.

• Part number and revision
• Board outline and dimensional tolerances
• Cutouts, chamfers, radii, bevels and scoring
• Finished hole sizes and tolerances
• Blind and buried via identification
• Material requirements
  • Define required Td/Td or IPC 4101/ requirements
  • Avoid restricting the design to a specific laminate manufacturer or product unless that material is technically required
• Layer stackup
• Finished board thickness and tolerance
• Controlled impedance requirements (more information below)
• Copper weight
• Surface finish
• Solder mask requirements
• Via plug, cap or fill requirements
• Applicable IPC or customer specifications
• Special instruction, test or marking requirements

Fabrication notes and the drawing are critical to a successful build!

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Stackup & Controlled Impedance

For controlled impedance designs, clearly identify:​

• Target impedance 
• Tolerance
• Applicable layer
• Trace width
• Differential spacing, if applicable
• Reference plane
• Coupon requirements, if applicable

​Learn More: Stackup Considerations

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Array & Panelization Requirements

If assembly or downstream processing requires a specific array configuration, provide those requirements with the fabrication package. If no customer array is specified, Westak can propose a manufacturing array for review.​

Include the following:

• Existing array drawing with dimensions
• Maximum array size
• Board orientation
• V-score vs. tab-route requirements
• Rail width

• Fiducials
• Tooling holes
• Breakaway requirements
• Component clearance near board edges
• Assembly house requirements 

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ReadMe / File Manifest

To ensure effective communication, we ask that a README file be included with files. The following information is recommended:

• Customer name
• Contact name, email address and phone number
• Part number and revision
• Complete file list
• File format 
• Layer identification
• Netlist identification
• Any intentional opens or shorts
• Special instructions
• Reference to superseded files, if applicable

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Ready to Submit Your PCB Data?

​A complete tooling package helps Westak review your design faster, reduce engineering questions and move your PCB into production more efficiently.