Rigid Interconnects

Attribute		Westak		Sprig		Int'l
Maximum Number of Layers		28		2		28
Minimum Line Width		.003"		.005"		.003"
Minimum Line Space		.003"		.005"		.003"
Height Aspect Ratio		16:1		8:1		16:1
Minimum Mechanical Finished Hole Diameter		.005"		.008"		.005"
Minimum Laser Drilled Hole Diameter		.004"		--		.004"
Minimum Pad Size		.015"		.020"		.015"
Minimum Dielectric Thickness		.003"		--		.003"
Minimum Finished PCB Thickness		.015"		.012"		.015"
Maximum Dielectric Thickness		.135"		.200"		.150"
Minimum Finished Thickness Tolerance		+/- 10%		+/- 10%		+/- 10%
Layer-toLayer Registration Tolerance		+/- .004"		+/- .004"		+/- .004"
Impedance Control Tolerance		+/- 7%		--		+/- 7%
Minimum LPI Soldermask Relief		+ .006"		+ .010"		+ .006"
Minimum LPI Soldermask Dam		.003"		.005"		.003"

*We are continuously increasing our technological capabilities. Please contact our engineering department for our most advanced technologies.

Flexible Interconnects

Attribute		Flex Interconnect
Maximum Number of Layers		18
Minimum Line Width - 0.5oz Copper		.002"
Minimum Line Width - 1.0oz Copper		.004"
Height Aspect Ratio		10:1
Minimum Mechanical Finished Hole Diameter		.006"
Minimum Laser Drilled Hole Diameter		.002"
Minimum Pad Size		FHS + .018"
Minimum Finished Thickness Tolerance		+/-8 %
Impedance Control Tolerance		+/- 10%
Minimum Soldermask Clearance		.004"
Minimum Soldermask Webbing		.005"
Minimum Coverfilm Clearance		.008"
Allowable Squeezout per Side		.003"
Product Offerings		Flex, Rigid-Flex, HDI Flex